Polyimide (PI) films are made of a polymer of imide monomer, known as, polyimide. These films are widely used in the production of heat resistant electronics components, such as pressure-sensitive tape, flexible printed circuit (FPC), and wires, due to their exceptional chemical resistance, high dielectric constant, and excellent temperature resistance. In addition, these films are also used in aerospace engineering and photovoltaics domain, owing to their high heat resistance, low thermal expansion, and great mechanical strength.
Other properties of polyimide films such as low weight, excellent tensile strength, flexibility, durability, water sorption, and damp-proof usage also make them viable for the electronics, industrial, aerospace, military, and medical sectors. Moreover, the cost-effectiveness and cut-through resistance characteristic of such films have led to their largescale usage in these industries. Owing to these reasons, the polyimide films market is expected to progress at a CAGR of 10.1% during forecast period. The market was valued at $1,850.0 million in 2016 and it is projected to reach $3,608.3 million by 2023.
According to P&S Intelligence, Asia-Pacific consumed the highest quantity of PI films in the past, and it is expected to adopt these films at the fastest pace in the upcoming years. This can be attributed to the burgeoning demand for PI film-based flexible electronic devices in the region. As the manufacturing facilities of foundries and semiconductors are the major end-users of PI films, the expansion of these production units in Japan, Taiwan, and China will augment the usage of these films in the region in the coming years.
Thus, the soaring usage of PI films in the electronics, aerospace, and automotive sectors, owing to their excellent chemical, mechanical, and thermal characteristics, is augmenting their production across the world.
Source: www.psmarketresearch.com
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